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AIzaSyAYiBZKx7MnpbEhh9jyipgxe19OcubqV5w
April 1, 2024
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SU HOU LEONG
⟶ Actualizado 2 dic 2019 ⟶
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Proposal
MIC model design
MIC Layer 3 (jacket) Implement heat solution (prepare the Experiment)
MIC Layer 2 (portable/reusable device) Transfer power/data from Layer 3 to 2
Communication Method / protocol
MIC Layer 1 (wiring / body sensor) Transfer data from Layer 1 to 2 Get power from layer 2
Final Report