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AIzaSyB4mHJ5NPEv-XzF7P6NDYXjlkCWaeKw5bc
November 30, 2025
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18 sept. 2025 - 华为HC大会

Description:

昇腾和鲲鹏芯片路线图公布，HBM内存芯片公布。灵衢2.0技术规范开放。
昇腾950PR、950DT，昇腾960，昇腾970
鲲鹏950，鲲鹏960，
HiBL 1.0容量128GB，带宽1.6TB/s；
HiZQ 2.0容量144GB，带宽4TB/s。

Ajouté au bande de temps:

5.个体发展

ByFrank Qiao
il y a 27 jrs
0
0
2379

Date:

18 sept. 2025
Maintenaint
~ Il y a 1 mois et 19 jours
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