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18 Sept 2025 Jahr - 华为HC大会

Beschreibung:

昇腾和鲲鹏芯片路线图公布，HBM内存芯片公布。灵衢2.0技术规范开放。
昇腾950PR、950DT，昇腾960，昇腾970
鲲鹏950，鲲鹏960，
HiBL 1.0容量128GB，带宽1.6TB/s；
HiZQ 2.0容量144GB，带宽4TB/s。

Zugefügt zum Band der Zeit:

4.东大演化

27 Tagen zuvor

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Datum:

18 Sept 2025 Jahr

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~ 1 months and 19 days ago

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